Course Details

Failure Analysis for IC Package

Basically it involves a process of animating and analyzing a chip to determine the root cause of a failure. A skilled failure analysis engineer can take a faulty chip, decapsulate and analyze it, isolate the failure, and pinpoint the reason for a semiconductor device failure. Then he or she can encapsulate it back into its package and hand over the chip back to you, so you can continue with your debug activities. To me, this is semiconductor’s magic at its best.